i ntegrated c ircuits d ivision www.ixysic.com ds-PLA143-r08 1 PLA143 single-pole, normally open optomos ? relay e 3 pb part # description PLA143 6-pin dip (50/tube) PLA143s 6-pin surface mount (50/tube) PLA143str 6-pin surface mount (1000/reel) parameters ratings units blocking voltage 600 v p load current 100 ma rms / ma dc input control current 2 ma on-resistance (max) 50 ? applications features description approvals ordering information pin configuration ? instrumentation ? multiplexers ? data acquisition ? electronic switching ? i/o subsystems ? meters (watt-hour, water, gas) ? medical equipment?patient/equipment isolation ? security ? aerospace ? industrial controls ? blocking voltage: 600v ? low input control current: 2ma ? 4000v rms input/output isolation ? low drive power requirements (ttl/cmos compatible) ? no moving parts ? high reliability ? arc-free with no snubbing circuits ? fcc compatible ? vde compatible ? no emi/rfi generation ? small 6-pin package ? machine insertable, wave solderable switching characteristics of normally open devices 1 3 2 4 5 6 + control C control nc load do not use load ac/dc configuration 1 3 2 4 5 6 + control C control nc + load C load dc only configuration form-a i f i load 10% 90% t on t off ? ul recognized component: file e76270 ? csa certified component: certificate 1175739 ? en/iec 60950-1 certified component: tuv certificate b 09 07 49410 004 the PLA143 is a single-pole, normally open (1-form-a) solid state relay that uses optically coupled mosfet technology to provide an en hanced input to output isolation of 4000v rms . its optically coupled outputs, which use the patented optomos architecture, are controlled by a highly efficient gaaias infrared led. the PLA143 can be used to replace mechanical relays, and offers the superior reliability associated with semiconductor devices. because it has no moving parts, it offers faster, bounce-free switching in a more compact surface mount or thru-hole package.
i ntegrated c ircuits d ivision www.ixysic.com 2 r08 PLA143 absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. parameter ratings units peak blocking voltage 600 v p reverse input voltage 5 v input control current 50 ma peak (10ms) 1 a input power dissipation 1 100 mw total package dissipation 2 800 mw isolation voltage, input to output 4000 v rms operational temperature -40 to +85 c storage temperature -40 to +125 c 1 derate linearly 1.33 mw / oc 2 derate linearly 6.67 mw / oc absolute maximum ratings @ 25oc electrical characteristics @ 25oc parameters conditions symbol min typ max units output characteristics load current, continuous ac/dc configuration - i l - - 100 ma rms / ma dc dc configuration - - - 170 ma dc peak load current t=10ms i lpk - - 350 ma p on-resistance 1 ac/dc configuration i l =100ma r on --50 ? dc configuration i l =170ma - - 14 off-state leakage current v l =600v p i leak -- 1 ? a switching speeds turn-on i f =5ma, v l =10v t on -- 5 ms turn-off t off -- 5 output capacitance v l =50v, f=1mhz c out -50 - pf input characteristics input control current to activate i l =90ma i f -- 2 ma input control current to deactivate - i f 0.2 0.35 - ma input voltage drop i f =5ma v f 0.9 1.2 1.4 v reverse input current v r =5v i r --10 ? a common characteristics input to output capacitance - c i/o -3 - pf 1 measurement taken within 1 second of on-time.
i ntegrated c ircuits d ivision PLA143 www.ixysic.com 3 r08 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. performance data @ 25oc (unless otherwise noted) * 35 30 25 20 15 10 5 0 1.17 1.19 1.21 1.23 1.25 led forward voltage drop (v) device count (n) typical led forward voltage drop (n=50, i f =5ma) 0.64 0.72 0.80 0.88 0.68 0.76 0.84 turn-on time (ms) device count (n) 25 20 15 10 5 0 typical turn-on time (n=50, i f =2ma, i l =100ma dc ) 0.22 0.26 0.30 0.28 0.24 turn-off time (ms) device count (n) 35 30 25 20 15 10 5 0 typical turn-off time (n=50, i f =2ma, i l =90ma dc ) 0.54 0.56 0.58 0.53 0.55 0.57 0.59 led current (ma) device count (n) 25 20 15 10 5 0 typical i f for switch operation (n=50, i l =100ma dc ) 25 20 15 10 5 0 0.34 0.36 0.38 0.33 0.35 0.37 0.39 led current (ma) device count (n) typical i f for switch dropout (n=50, i l =100ma dc ) 35 30 25 20 15 10 5 0 34.3 34.9 35.5 36.1 34.6 35.2 35.8 device count (n) on-resistance ( : ) typical on-resistance distribution (n=50, i l =100ma dc ) 35 30 25 20 15 10 5 0 777 787 797 807 782 792 802 blocking voltage (v p ) device count (n) typical blocking voltage distribution (n=50) led forward voltage drop (v) typical led forward voltage drop vs. temperature temperature (oc) 1.8 1.6 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 80 120 100 i f =50ma i f =10ma i f =5ma led forward current (ma) turn-on time (ms) 0 5 1015202530354045 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 50 typical turn-on time vs. led forward current (i l =100ma dc ) led forward current (ma) turn-off time (ms) 0 5 1015202530354045 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 50 typical turn-off time vs. led forward current (i l =100ma dc )
i ntegrated c ircuits d ivision www.ixysic.com 4 r08 PLA143 *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written specifications, please contact our application department. performance data @ 25oc (unless otherwise noted) * turn-on time (ms) -40 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 80 100 typical turn-on time vs. temperature (i l =70ma dc ) temperature (oc) i f =5ma i f =10ma turn-off time (ms) -40 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -20 0 20 40 60 80 100 typical turn-off time vs. temperature (i f =5ma, i l =70ma dc ) temperature (oc) -40 70 60 50 40 30 20 10 -20 0 20 40 60 80 100 on-resistance ( : ) typical on-resistance vs. temperature (i f =2ma, i l =50ma dc ) temperature (oc) led current (ma) -40 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -20 0 20 40 60 80 100 typical i f for switch operation vs. temperature (i l =70ma dc ) temperature (oc) led current (ma) -40 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -20 0 20 40 60 80 100 typical i f for switch dropout vs. temperature (i l =70ma dc ) temperature (oc) load voltage (v) load current (ma) 150 100 50 0 -50 -100 -150 -6 -4 -2 0 2 4 6 typical load current vs. load voltage (i f =5ma) load current (ma) 110 100 90 80 70 60 50 40 30 20 temperature (oc) -40 -20 0 20 40 60 80 120 100 maximum load current vs. temperature (i f =2ma) blocking voltage (v p ) -40 950 900 850 800 750 700 650 600 -20 0 20 40 60 80 100 typical blocking voltage vs. temperature temperature (oc) -40 0.040 0.035 0.030 0.025 0.020 0.015 0.010 0.005 0 -20 0 20 40 60 80 100 leakage ( p a) typical leakage vs. temperature measured across pins 4&6 temperature (oc) time load current (a) 10 p s 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 1ms 100 p s 100ms 1s 10ms 10s 100s energy rating curve
i ntegrated c ircuits d ivision PLA143 www.ixysic.com 5 r08 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) rating PLA143 / PLA143s msl 1 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device maximum temperature x time PLA143 / PLA143s 250oc for 30 seconds board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated circuits division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine- or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ultrasonic energy should not be used. e 3 pb
i ntegrated c ircuits d ivision www.ixysic.com 6 r08 PLA143 dimensions mm (inches) pcb hole pattern 6.350 0.127 (0.250 0.005) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) 5.080 0.127 (0.200 0.005) 6 - 0.800 dia. (6 - 0.031 dia.) 0.254 0.0127 (0.010 0.0005) 9.144 0.508 (0.360 0.020) 7.239 typ (0.285 typ) 7.620 0.254 (0.300 0.010) 3.302 0.051 (0.130 0.002) 4.064 typ (0.160 typ) 0.457 0.076 (0.018 0.003) 8.382 0.381 (0.330 0.015) 2.54 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 1.651 0.254 (0.065 0.010) pin 1 dimensions mm (inches) pcb land pattern 0.254 0.0127 (0.010 0.0005) 7.620 0.254 (0.300 0.010) 0.635 0.127 (0.025 0.005) 3.302 0.051 (0.130 0.002) 4.445 0.254 (0.175 0.010) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 8.382 0.381 (0.330 0.015) 2.54 0.127 (0.100 0.005) 9.524 0.508 (0.375 0.020) 6.350 0.127 (0.250 0.005) 0.457 0.076 (0.018 0.003) 1.651 0.254 (0.065 0.010) 1.651 0.254 (0.065 0.010) pin 1 PLA143 PLA143s mechanical dimensions
i ntegrated c ircuits d ivision specification: ds-PLA143-r08 ? copyright 2012, ixys integrated circuits division all rights reserved. printed in usa. 12/22/2012 for additional information please visit our website at: www.ixysic.com 7 PLA143 ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infri ngement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. notes: 1. all dimensions carry tolerances of eia standard 481-2 2. the tape complies with all notes for constant dimensions listed on page 5 of eia-481-2 dimensions mm (inches) embossment embossed carrier 330.2 dia (13.00 dia) top cover tape thickness 0.102 max (0.004 max) w=16.00 (0.63) b 0 = 10.10 (0.398) a 0 = 10.10 (0.398) p = 12.00 (0.472) k 1 = 3.80 (0.15) k 0 = 4.90 (0.19) user direction of feed PLA143str tape & reel
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